1. Heat Generation: Electronic components such as processors, graphics cards, power supplies, and other devices generate heat during operation.
2. Heat Conduction: Heat is transferred from the internal components to the heatsink through direct contact or thermal interface materials (e.g., thermal paste).
3. Heatsink Design: The heatsink is a metal structure designed to maximize the surface area for heat dissipation. It consists of multiple fins or plates that increase the contact surface with the surrounding air.
4. Airflow: A fan or multiple fans are used to generate airflow. The fans draw in cool air from the surroundings and direct it over the heatsink.
5. Heat Dissipation: As the air moves across the heatsink fins, it absorbs heat from the metal. The increased surface area of the heatsink improves heat transfer and allows the air to carry away the dissipated heat.
6. Thermal Conductivity: The heat transfer efficiency of the heatsink depends on the thermal conductivity of the material used (often aluminum or copper) and the design of the heatsink to optimize airflow.
7. Exhaust: The heated air is then exhausted out of the system, usually through vents or openings in the case.
8. Temperature Monitoring: Most systems have built-in temperature sensors that monitor the temperature of critical components. If the temperature exceeds safe limits, the fan speed may be increased, or the system may take measures to prevent overheating.
Air-cooled systems are more prevalent in desktops and laptops due to their simplicity, cost-effectiveness, and ease of maintenance compared to liquid-cooled systems. However, they may be less efficient at dissipating large amounts of heat generated by high-performance components.
